Production equipment & automation
Source & evidence
Trade-fair listing
Aufbau- & Verbindungstechnik (Packaging & Assembly) [crosswalk: Aufbau- & Verbindungstechnik (Packaging & Assembly)]
EFX 2026 exhibitor directory
Checked 1 Oct 2026

Chiplet Assembly, Hybrid Bonding, Si-Interposer Technologien, Fan-Out Wafer Level Packaging, Kryo-Packaging, die Integration von Speichern mit hoher Bandbreite (HBMs), HF-Charakterisierung und das Packaging für 5G / 6G-Anwendungen sind nur einige Technologien und Beispiele unseres Leistungskatalogs.
Trade-fair listing
Aufbau- & Verbindungstechnik (Packaging & Assembly) [crosswalk: Aufbau- & Verbindungstechnik (Packaging & Assembly)]
EFX 2026 exhibitor directory
Checked 1 Oct 2026
Gustav-Meyer-Allee 25, 13355 Berlin, Germany
Berlin, Germany
Trade-fair listing
Germany
EFX 2026 exhibitor directory
Checked 1 Oct 2026
Trade-fair listing
EFX 2026 exhibitor directory
Checked 1 Oct 2026
Trade-fair listing
EFX 2026 exhibitor directory
Checked 1 Oct 2026
| Capability | Documented scope | Supporting source |
|---|---|---|
| Microelectronics packaging | Listed capability; detailed scope not provided. | Source & evidenceTrade-fair listing |
Every claim keeps its source. Company-reported information and independent verification are labelled separately.
Trade-fair listing
Aufbau- & Verbindungstechnik (Packaging & Assembly) [crosswalk: Aufbau- & Verbindungstechnik (Packaging & Assembly)]
EFX 2026 exhibitor directory
Checked 1 Oct 2026
Trade-fair listing
Chiplet-Technologie [crosswalk: Chiplet-Technologie]
EFX 2026 exhibitor directory
Checked 1 Oct 2026
Trade-fair listing
Germany
EFX 2026 exhibitor directory
Checked 1 Oct 2026
Trade-fair listing
EFX 2026 exhibitor directory
Checked 1 Oct 2026
Trade-fair listing
EFX 2026 exhibitor directory
Checked 1 Oct 2026
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EFX 2026 exhibitor directory · 1 Oct 2026
EFX 2026 exhibitor directory · 1 Oct 2026
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