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Microelectronics packaging suppliers in Germany

15 companies in our directory list microelectronics packaging in Germany. 13 exhibit at EFX 2026.

Suppliers
15
By type
Contract manufacturer (EMS) 4 · Association or cluster 1
At EFX 2026
13
At electronica 2026
4
  1. LPKF Laser & Electronics SE

    Type not confirmed · Germany

    EFX 2026
    In 5 days    9C38

    Precision Manufacturing Systems to create more powerful electronic systems.

    • Microelectronics packaging
    • Circuit protection & EMC components
    • EMI / ESD shielding
    • Rigid PCBs
    • HDI PCBs
  2. AEMtec GmbH

    Contract manufacturer (EMS) · Germany

    electronica 2026
    10 Nov    A2.319

    Your Global Partner for CUSTOMIZED MICROSYSTEMS & OPTOELECTRONICS

    • Microelectronics packaging
    • Ceramic substrates & hybrid circuits
    • MEMS & motion sensors
    • SMT assembly
    • THT assembly
  3. ml&s manufacturing logistics and services GmbH & Co. KG

    Contract manufacturer (EMS) · Germany

    electronica 2026
    10 Nov    A1.455

    Beyond Manufacturing

    • Microelectronics packaging
    • Hardware / electronics design
    • Box build & system integration
    • Automotive
    • E-mobility
  4. AAT Aston GmbH

    Type not confirmed · Germany

    EFX 2026
    In 5 days    9A90

    Der Systemlieferant für die Elektronik & Kabel Verarbeitende Industrie

    • Microelectronics packaging
    • Solder, adhesives & tapes
    • Packaging & assembly equipment (microelectronics)
    • Inspection & vision systems
    • Joining technology
  5. ATN Automatisierungstechnik Niemeier GmbH

    Type not confirmed · Germany

    EFX 2026
    In 5 days    9A58

    ATN entwickelt, produziert und vertreibt Komponenten, Systeme, Anlagen und Software für die Elektronikfertigung.

    • Microelectronics packaging
    • Electronics production equipment
    • Packaging & assembly equipment (microelectronics)
    • Handling technology & robotics
    • Joining technology
  6. Hahn-Schickard gGmbH

    Type not confirmed · Germany

    EFX 2026
    In 5 days    9B30

    Hahn-Schickard ist Forschungs- und Entwicklungspartner. Von der ersten Idee bis zur Fertigung entwickeln wir für Sie intelligente Produkte mit Mikrosystemtechnik.

    • Microelectronics packaging
    • Ceramic substrates & hybrid circuits
    • Production equipment & automation
    • Materials & consumables
    • Ceramics
  7. Finetech GmbH & Co. KG

    Type not confirmed · Germany

    EFX 2026
    In 5 days    9A24

    Die bonders and process development. Packaging expertise, concept to production.

    • Microelectronics packaging
    • Packaging & assembly equipment (microelectronics)
    • Production equipment & automation
    • AI & machine learning
    • Telecom, 5G/6G & wireless
  8. EFX 2026
    In 5 days    9D62

    Chiplet Assembly, Hybrid Bonding, Si-Interposer Technologien, Fan-Out Wafer Level Packaging, Kryo-Packaging, die Integration von Speichern mit hoher Bandbreite (HBMs), HF-Charakterisierung und das Packaging für 5G / 6G-Anwendungen sind nur einige Technologien und Beispiele…

    • Microelectronics packaging
    • Production equipment & automation
  9. Photonics Systems GmbH

    Type not confirmed · Germany

    EFX 2026
    In 5 days    9B70
    • Microelectronics packaging
    • Handling technology & robotics
    • Manufacturing & factory software
    • HDI PCBs
    • Flexible PCBs
  10. Fraunhofer-Institut für Angewandte Festkörperphysik IAF

    Contract manufacturer (EMS) · Germany

    EFX 2026
    In 5 days    9B36B
    • Microelectronics packaging
    • Manufacturing & factory software
    • Production equipment & automation
    • Design & development
    • AI & machine learning
  11. Hesse GmbH Stammsitz

    Type not confirmed · Germany

    EFX 2026
    In 5 days    9C48
    • Microelectronics packaging
    • Packaging & assembly equipment (microelectronics)
    • Joining technology
    • Production equipment & automation
    • Joining & welding
  12. HAW Kiel Hochschule für Angewandte Wissenschaften Kiel

    Contract manufacturer (EMS) · Germany

    EFX 2026
    In 5 days    9B36D
    • Microelectronics packaging
    • Production equipment & automation
    • Design & development
  13. Forschungsfabrik Mikroelektronik Deutschland

    Association or cluster · Germany

    EFX 2026
    In 5 days    9D60
    • Microelectronics packaging
    • Production equipment & automation
  14. imec Germany GmbH

    Type not confirmed · Germany

    EFX 2026
    In 5 days    9B36A
    • Microelectronics packaging
    • Production equipment & automation
  15. Pac Tech - Packaging Technologies GmbH

    Type not confirmed · Germany

    EFX 2026
    In 5 days    9C50
    • Microelectronics packaging
    • Production equipment & automation

Listings come from trade-fair directories and company websites; each profile shows the source of every fact.