Packaging & assembly equipment (microelectronics) suppliers

48 companies in our directory list packaging & assembly equipment (microelectronics). Most are based in Germany (27), United States (5) and China (4). 45 exhibit at electronica 2026.

Suppliers
48
By type
Contract manufacturer (EMS) 6 · Distributor 1
At electronica 2026
45
At EFX 2026
4
  1. AAT Aston GmbH

    Type not confirmed · Germany

    EFX 2026
    In 4 days
    9A90

    Der Systemlieferant für die Elektronik & Kabel Verarbeitende Industrie

    • Packaging & assembly equipment (microelectronics)
    • Solder, adhesives & tapes
    • Microelectronics packaging
    • Inspection & vision systems
    • Joining technology
  2. KOSMEK Europe GmbH

    Type not confirmed · Austria

    electronica 2026
    10 Nov
    C2.446

    Industrial Automation Products for Semiconductor Manufacturing

    • Packaging & assembly equipment (microelectronics)
    • Handling technology & robotics
    • Semiconductor & wafer process equipment
    • Inspection & vision systems
    • Industrial automation
  3. Shin-Etsu Microsi

    Type not confirmed · United States

    electronica 2026
    10 Nov
    C2.148

    Shin-Etsu MicroSi is a driving force in the semiconductor industry worldwide.

    • Packaging & assembly equipment (microelectronics)
    • Industrial & embedded PCs
    • Lenses, optics & filters
    • Frame grabbers & vision PCs
    • Solder, adhesives & tapes
  4. AP&S International GmbH

    Contract manufacturer (EMS) · Germany

    electronica 2026
    10 Nov
    B1.656

    AP&S - WE ARE YOUR PARTNER FOR WET PROCESS EQUIPMENT

    • Packaging & assembly equipment (microelectronics)
    • Semiconductor & wafer process equipment
    • Cleanroom, contamination & climate control
    • Manufacturing & factory software
    • Printed & flexible electronics
  5. ATN Automatisierungstechnik Niemeier GmbH

    Type not confirmed · Germany

    EFX 2026
    In 4 days
    9A58

    ATN entwickelt, produziert und vertreibt Komponenten, Systeme, Anlagen und Software für die Elektronikfertigung.

    • Packaging & assembly equipment (microelectronics)
    • Microelectronics packaging
    • Electronics production equipment
    • Handling technology & robotics
    • Joining technology
  6. Dr. Johannes Heidenhain GmbH

    Type not confirmed · Germany

    electronica 2026
    10 Nov
    C2.355

    HEIDENHAIN CORPORATE GROUP: Higher precision and throughput for chipmaking

    • Packaging & assembly equipment (microelectronics)
    • Semiconductor & wafer process equipment
    • Inspection & vision systems
    • Industrial automation
    • AI & machine learning
  7. Sono-Tek

    Type not confirmed · United States

    electronica 2026
    10 Nov
    C1.254

    Precision ultrasonic spray coating for complex wafer topographies

    • Packaging & assembly equipment (microelectronics)
    • Semiconductor & wafer process equipment
    • Printed & flexible electronics
    • Automotive
    • Consumer electronics
  8. Spraying Systems Deutschland GmbH

    Contract manufacturer (EMS) · Germany

    electronica 2026
    10 Nov
    C2.234

    Together, we make every drop count

    • Packaging & assembly equipment (microelectronics)
    • Process chemicals & gases
    • Semiconductor & wafer process equipment
    • Automotive
    • Industrial automation
  9. MS TECH EMEA SL

    Type not confirmed · Spain

    electronica 2026
    10 Nov
    C2.119

    Smart automation, vision systems and AI software for electronics manufacturing.

    • Packaging & assembly equipment (microelectronics)
    • Manufacturing & factory software
    • Semiconductor & wafer process equipment
    • Handling technology & robotics
    • Semiconductor manufacturing
  10. NIKON Precision Europe GmbH

    Type not confirmed · Germany

    electronica 2026
    10 Nov
    B1.117

    Nikon offers the most extensive selection of lithography steppers and scanners.

    • Packaging & assembly equipment (microelectronics)
    • Inspection & vision systems
    • Semiconductor & wafer process equipment
    • Printed & flexible electronics
    • Consumer electronics
  11. Plasmatreat GmbH

    Contract manufacturer (EMS) · Germany

    electronica 2026
    10 Nov
    C1.567

    Plasma surface modification takes semiconductor production to the next level.

    • Packaging & assembly equipment (microelectronics)
    • Semiconductor & wafer process equipment
    • E-mobility
    • Power electronics & energy
    • Semiconductor manufacturing
  12. WITTENSTEIN SE

    Type not confirmed · Germany

    electronica 2026
    10 Nov
    C1.838

    Precision drive systems, gearboxes and motors for semiconductor equipment.

    • Packaging & assembly equipment (microelectronics)
    • Handling technology & robotics
    • Semiconductor & wafer process equipment
    • Production equipment & automation
    • Industrial automation
  13. XTPL S.A.

    Type not confirmed · Poland

    electronica 2026
    10 Nov
    C1.561

    Ultra-Precise Dispensing: mask-less 1 μm interconnects on any surface

    • Packaging & assembly equipment (microelectronics)
    • Test systems & ATE
    • Semiconductor & wafer process equipment
    • Printed & flexible electronics
    • Consumer electronics
  14. ACCRETECH (Europe) GmbH

    Type not confirmed · Germany

    electronica 2026
    10 Nov
    B1.401

    Accretech develops advanced systems and machines for semiconductor manufacturing

    • Packaging & assembly equipment (microelectronics)
    • Test systems & ATE
    • Semiconductor & wafer process equipment
    • Automotive
    • Power electronics & energy
  15. Akoneer

    Type not confirmed · Lithuania

    electronica 2026
    10 Nov
    C2.212

    SSAIL technology produces copper traces down to 1 µm on any dielectric material

    • Packaging & assembly equipment (microelectronics)
    • Displays & HMI
    • Production equipment & automation
    • Printed & flexible electronics
    • Consumer electronics
  16. JAT - Jenaer Antriebstechnik GmbH

    Type not confirmed · Germany

    electronica 2026
    10 Nov
    B0.502

    Custom servo and drive systems for high-precision positioning

    • Packaging & assembly equipment (microelectronics)
    • Semiconductor & wafer process equipment
    • Production equipment & automation
    • Automotive
    • Industrial automation
  17. merconics GmbH & Co. KG

    Contract manufacturer (EMS) · Germany

    electronica 2026
    10 Nov
    B1.840

    Your premium sales and service partner for semiconductor capital equipment.

    • Packaging & assembly equipment (microelectronics)
    • Semiconductor & wafer process equipment
    • Production equipment & automation
    • Consulting & technology transfer
    • Renewable energy & photovoltaics
  18. Pentamaster Instrumentation Sdn. Bhd.

    Type not confirmed · Malaysia

    electronica 2026
    10 Nov
    B1.818

    Pentamaster: Automation, test, inspection and advanced packaging solutions.

    • Packaging & assembly equipment (microelectronics)
    • Test systems & ATE
    • Inspection & vision systems
    • Industrial automation
    • AI & machine learning
  19. YSystems Ltd.

    Type not confirmed · Japan

    electronica 2026
    10 Nov
    B1.840

    You can only improve what you can measure!

    • Packaging & assembly equipment (microelectronics)
    • Inspection & vision systems
    • Semiconductor & wafer process equipment
    • Renewable energy & photovoltaics
    • Lighting
  20. Finetech GmbH & Co. KG

    Type not confirmed · Germany

    EFX 2026
    In 4 days
    9A24

    Die bonders and process development. Packaging expertise, concept to production.

    • Packaging & assembly equipment (microelectronics)
    • Microelectronics packaging
    • Production equipment & automation
    • AI & machine learning
    • Telecom, 5G/6G & wireless
  21. Novel Technology Transfer GmbH

    Type not confirmed · Germany

    electronica 2026
    10 Nov
    B1.916

    „Innovations are realized – by Novel Technology Transfer GmbH“

    • Packaging & assembly equipment (microelectronics)
    • Semiconductor & wafer process equipment
    • Handling technology & robotics
    • Production equipment & automation
    • Semiconductor manufacturing
  22. PVA TePla AG

    Type not confirmed · Germany

    electronica 2026
    10 Nov
    C1.301

    Diversified & Specialized: Trust in our expertise in all important technologies

    • Packaging & assembly equipment (microelectronics)
    • Inspection & vision systems
    • Semiconductor & wafer process equipment
    • Manufacturing & factory software
    • Semiconductor manufacturing
  23. Shandong Liansheng Electronic Equipment Co., Ltd.

    Contract manufacturer (EMS) · China

    electronica 2026
    10 Nov
    C2.214

    Automatic Cleaning System

    • Packaging & assembly equipment (microelectronics)
    • Test systems & ATE
    • Semiconductor & wafer process equipment
    • Process chemicals & gases
    • Semiconductor manufacturing
  24. Suzhou Delphi Laser Co., Ltd.

    Type not confirmed · China

    electronica 2026
    10 Nov
    B1.840

    Precision laser processing for SiC, wafers and semiconductor manufacturing.

    • Packaging & assembly equipment (microelectronics)
    • Semiconductor & wafer process equipment
    • Production equipment & automation
    • Power electronics & energy
    • Consumer electronics
  25. TELTEC

    Distributor · Germany

    electronica 2026
    10 Nov
    B1.301 +1

    TELTEC, founded in 83, is the leading wafer fab equipment&materials distributor.

    • Packaging & assembly equipment (microelectronics)
    • Inspection & vision systems
    • Semiconductor & wafer process equipment
    • Kitting & logistics
    • Semiconductor manufacturing
  26. electronica 2026
    10 Nov
    C2.146

    Evergrand: specialty gas, chemical supply systems, cleanroom & MEP.

    • Packaging & assembly equipment (microelectronics)
    • Semiconductor & wafer process equipment
    • Cleanroom, contamination & climate control
    • Industrial automation
    • Sustainability & circular economy
  27. ACM Research Inc.

    Type not confirmed · United States

    electronica 2026
    10 Nov
    C1.129

    Explore our semiconductor process equipment for front-end & advanced packaging.

    • Packaging & assembly equipment (microelectronics)
    • Semiconductor & wafer process equipment
    • Power electronics & energy
    • AI & machine learning
  28. Active Fiber Systems GmbH (AFS)

    Type not confirmed · Germany

    electronica 2026
    10 Nov
    B1.317

    From world-record science to industry-ready laser solutions

    • Packaging & assembly equipment (microelectronics)
    • Semiconductor & wafer process equipment
    • Production equipment & automation
    • Power electronics & energy
  29. JTA Ltd.

    Type not confirmed · United Kingdom

    electronica 2026
    10 Nov
    C1.171

    Wafer Tape/detape/mount, Temporary bonding, SiC wafer backgrind and CMP

    • Packaging & assembly equipment (microelectronics)
    • Solder, adhesives & tapes
    • Displays & HMI
    • Production equipment & automation
  30. LINTEC Advanced Technologies (Europe) GmbH

    Type not confirmed · Germany

    electronica 2026
    10 Nov
    B1.826

    We make premium adhesive tapes & tools for semiconductor back-end production

    • Packaging & assembly equipment (microelectronics)
    • Production equipment & automation
    • Automotive
    • Power electronics & energy
  31. ProSys Inc.

    Type not confirmed · United States

    electronica 2026
    10 Nov
    C1.144

    ProSys specializes in megasonics for wet single wafer and batch applications.

    • Packaging & assembly equipment (microelectronics)
    • Semiconductor & wafer process equipment
    • Automotive
    • Consumer electronics
  32. SCREEN SPE Germany GmbH

    Type not confirmed · Germany

    electronica 2026
    10 Nov
    B1.700

    SCREEN - Innovation for a sustainable world

    • Packaging & assembly equipment (microelectronics)
    • Inspection & vision systems
    • Semiconductor & wafer process equipment
    • Semiconductor manufacturing
  33. Siconnex

    Type not confirmed · Austria

    electronica 2026
    10 Nov
    B1.453

    Siconnex: Equipment Manufacturer for wet applications

    • Packaging & assembly equipment (microelectronics)
    • Semiconductor & wafer process equipment
    • Handling technology & robotics
    • Semiconductor manufacturing
  34. UniTemp GmbH

    Type not confirmed · Germany

    electronica 2026
    10 Nov
    B1.156

    Unitemp - RTP ovens, solder reflow systems and other microelectronics equipment

    • Packaging & assembly equipment (microelectronics)
    • Semiconductor & wafer process equipment
    • Production equipment & automation
    • Renewable energy & photovoltaics
  35. YASKAWA Europe Technology Ltd.

    Type not confirmed · Israel

    electronica 2026
    10 Nov
    C1.311

    Yaskawa Europe Technology leads semiconductor fab automation solutions in Europe

    • Packaging & assembly equipment (microelectronics)
    • Displays & HMI
    • Production equipment & automation
    • Industrial automation
  36. Asahi Diamond Industrial Germany GmbH

    Type not confirmed · Germany

    electronica 2026
    10 Nov
    B1.110

    Asahi Diamond is one of the world's leading manufacturers of Dia and CBN tools.

    • Packaging & assembly equipment (microelectronics)
    • Process chemicals & gases
    • Production equipment & automation
  37. DISCO HI-TEC EUROPE GmbH

    Contract manufacturer (EMS) · Germany

    electronica 2026
    10 Nov
    B1.201

    Total solutions for dicing, grinding and polishing of semiconductor wafers

    • Packaging & assembly equipment (microelectronics)
    • Production equipment & automation
    • Semiconductor manufacturing
  38. ERS electronic GmbH

    Type not confirmed · Germany

    electronica 2026
    10 Nov
    B1.356

    Maximizing yield with advanced semiconductor equipment

    • Packaging & assembly equipment (microelectronics)
    • Test systems & ATE
    • Semiconductor manufacturing
  39. Marubeni International (Europe) GmbH

    Type not confirmed · Germany

    electronica 2026
    10 Nov
    C2.159

    Shogo Shosha

    • Packaging & assembly equipment (microelectronics)
    • Semiconductor & wafer process equipment
    • Consumer electronics
  40. MUEGGE GmbH

    Type not confirmed · Germany

    electronica 2026
    10 Nov
    C2.108

    The MUEGGE Group is a global leader in advanced microwave and plasma technology.

    • Packaging & assembly equipment (microelectronics)
    • Semiconductor & wafer process equipment
    • Power electronics & energy

Listings come from trade-fair directories and company websites; each profile shows the source of every fact.