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Packaging & assembly equipment (microelectronics) suppliers

48 companies in our directory list packaging & assembly equipment (microelectronics). Most are based in Germany (27), United States (5) and China (4). 45 exhibit at electronica 2026.

Suppliers
48
By type
Contract manufacturer (EMS) 6 · Distributor 1
At electronica 2026
45
At EFX 2026
4
  1. Notion Systems GmbH

    Type not confirmed · Germany

    electronica 2026
    10 Nov    B1.234

    Technology for microelectronics Manufacturing

    • Packaging & assembly equipment (microelectronics)
    • Semiconductor & wafer process equipment
    • Industrial automation
  2. Ramgraber Semiconductor Equipment GmbH

    Type not confirmed · Germany

    electronica 2026
    10 Nov    B1.171

    Ramgraber is your specialist in wet processing solutions

    • Packaging & assembly equipment (microelectronics)
    • Semiconductor & wafer process equipment
    • Process chemicals & gases
  3. Rui Yin (HK) Co., Ltd.

    Type not confirmed · China

    electronica 2026
    10 Nov    C1.910

    RUIYIN (HK) CO., LTD.

    • Packaging & assembly equipment (microelectronics)
    • Test systems & ATE
    • Semiconductor manufacturing
  4. ADT Ltd.

    Type not confirmed · Israel

    electronica 2026
    10 Nov    B1.152

    ADT is specialized in the development and manufacturing of systems and blades.

    • Packaging & assembly equipment (microelectronics)
    • Solder, adhesives & tapes
  5. Grintimate Precision Industry Co., Ltd.

    Type not confirmed · Taiwan

    electronica 2026
    10 Nov    C1.333

    Wafer grinding machine with EFEM

    • Packaging & assembly equipment (microelectronics)
    • Semiconductor & wafer process equipment
  6. ONTOS Equipment Systems

    Type not confirmed · United States

    electronica 2026
    10 Nov    C1.120

    ONTOS Atmospheric Plasma enhances bonding strength in semiconductor packaging.

    • Packaging & assembly equipment (microelectronics)
    • Semiconductor & wafer process equipment
  7. SET Corporation S.A.

    Type not confirmed · France

    electronica 2026
    10 Nov    B1.456

    World leading supplier of Flip-Chip Bonders excelling in high-end applications

    • Packaging & assembly equipment (microelectronics)
  8. Hesse GmbH Stammsitz

    Type not confirmed · Germany

    EFX 2026
    In 4 days    9C48
    • Packaging & assembly equipment (microelectronics)
    • Joining technology
    • Microelectronics packaging
    • Production equipment & automation
    • Joining & welding

Listings come from trade-fair directories and company websites; each profile shows the source of every fact.