Microelectronics packaging suppliers
25 companies in our directory list microelectronics packaging. Most are based in Germany (15), United Kingdom (2) and Austria (1). 15 exhibit at EFX 2026.
- Suppliers
- 25
- By type
- Contract manufacturer (EMS) 12 · Association or cluster 1
- At EFX 2026
- 15
- At electronica 2026
- 13
- electronica 2026
10 NovA1.107SVI > Your preferred partner for Design & Electronics Manufacturing Services
- electronica 2026
10 NovA1.658Your global partner in electronics and electromechanical manufacturing
- electronica 2026
10 NovA1.543Your EMS partner in southern Europe
- EFX 2026
In 5 days9C38Precision Manufacturing Systems to create more powerful electronic systems.
- EFX 2026
In 5 days9B14Vývoj elektroniky od konceptu po certifikovaný produkt.
- electronica 2026
10 NovA2.319Your Global Partner for CUSTOMIZED MICROSYSTEMS & OPTOELECTRONICS
- electronica 2026
10 NovA1.455Beyond Manufacturing
- EFX 2026
In 5 days9A90Der Systemlieferant für die Elektronik & Kabel Verarbeitende Industrie
- EFX 2026
In 5 days9A58ATN entwickelt, produziert und vertreibt Komponenten, Systeme, Anlagen und Software für die Elektronikfertigung.
- electronica 2026
10 NovA2.479A group of specialist electronics manufacturers you can depend on.
- electronica 2026
10 NovA1.536Providing custom-built electronics & mechatronics solutions for almost 30 years.
- electronica 2026
10 NovB4.269Design & manufacture of low power radio solutions. Outsourcing company for IMS board, Power Resistors, Thick Film Technology.
- electronica 2026
10 NovA6.469/6Global provider of integrated solutions for smart controllers
- electronica 2026
10 NovA2.479PCBA and semiconductor packaging (OSAT), wire bonding to box build.
- EFX 2026
In 5 days9B30Hahn-Schickard ist Forschungs- und Entwicklungspartner. Von der ersten Idee bis zur Fertigung entwickeln wir für Sie intelligente Produkte mit Mikrosystemtechnik.
- EFX 2026
In 5 days9A24Die bonders and process development. Packaging expertise, concept to production.
- EFX 2026
In 5 days9D39BTU makes custom furnaces and reflow ovens.
- EFX 2026
In 5 days9D62Chiplet Assembly, Hybrid Bonding, Si-Interposer Technologien, Fan-Out Wafer Level Packaging, Kryo-Packaging, die Integration von Speichern mit hoher Bandbreite (HBMs), HF-Charakterisierung und das Packaging für 5G / 6G-Anwendungen sind nur einige Technologien und Beispiele…
- EFX 2026
In 5 days9B70 - EFX 2026
In 5 days9B36B - EFX 2026
In 5 days9C48 - EFX 2026
In 5 days9B36D - EFX 2026
In 5 days9D60 - EFX 2026
In 5 days9B36A - EFX 2026
In 5 days9C50
Listings come from trade-fair directories and company websites; each profile shows the source of every fact.
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