Microelectronics packaging suppliers

25 companies in our directory list microelectronics packaging. Most are based in Germany (15), United Kingdom (2) and Austria (1). 15 exhibit at EFX 2026.

Suppliers
25
By type
Contract manufacturer (EMS) 12 · Association or cluster 1
At EFX 2026
15
At electronica 2026
13
  1. SVI Public Company Ltd.

    Contract manufacturer (EMS) · Austria

    electronica 2026
    10 Nov
    A1.107

    SVI > Your preferred partner for Design & Electronics Manufacturing Services

    • Microelectronics packaging
    • Wire harnesses
    • Cable assemblies
    • Hardware / electronics design
    • PCB layout
  2. Norautron AS

    Contract manufacturer (EMS) · Norway

    electronica 2026
    10 Nov
    A1.658

    Your global partner in electronics and electromechanical manufacturing

    • Microelectronics packaging
    • Cable assemblies
    • THT assembly
    • Obsolescence & inventory management
    • Box build & system integration
  3. DigiProces

    Contract manufacturer (EMS) · Spain

    electronica 2026
    10 Nov
    A1.543

    Your EMS partner in southern Europe

    • Microelectronics packaging
    • Enclosures & housings
    • Ceramic substrates & hybrid circuits
    • EDA / CAD / CAE software
    • SMT assembly
  4. LPKF Laser & Electronics SE

    Type not confirmed · Germany

    EFX 2026
    In 5 days
    9C38

    Precision Manufacturing Systems to create more powerful electronic systems.

    • Microelectronics packaging
    • Circuit protection & EMC components
    • EMI / ESD shielding
    • Rigid PCBs
    • HDI PCBs
  5. CEMS HOLDING a.s.

    Contract manufacturer (EMS) · Czechia

    EFX 2026
    In 5 days
    9B14

    Vývoj elektroniky od konceptu po certifikovaný produkt.

    • Microelectronics packaging
    • Cable assemblies
    • SMT assembly
    • THT assembly
    • PCB layout
  6. AEMtec GmbH

    Contract manufacturer (EMS) · Germany

    electronica 2026
    10 Nov
    A2.319

    Your Global Partner for CUSTOMIZED MICROSYSTEMS & OPTOELECTRONICS

    • Microelectronics packaging
    • Ceramic substrates & hybrid circuits
    • MEMS & motion sensors
    • SMT assembly
    • THT assembly
  7. ml&s manufacturing logistics and services GmbH & Co. KG

    Contract manufacturer (EMS) · Germany

    electronica 2026
    10 Nov
    A1.455

    Beyond Manufacturing

    • Microelectronics packaging
    • Hardware / electronics design
    • Box build & system integration
    • Automotive
    • E-mobility
  8. AAT Aston GmbH

    Type not confirmed · Germany

    EFX 2026
    In 5 days
    9A90

    Der Systemlieferant für die Elektronik & Kabel Verarbeitende Industrie

    • Microelectronics packaging
    • Solder, adhesives & tapes
    • Packaging & assembly equipment (microelectronics)
    • Inspection & vision systems
    • Joining technology
  9. ATN Automatisierungstechnik Niemeier GmbH

    Type not confirmed · Germany

    EFX 2026
    In 5 days
    9A58

    ATN entwickelt, produziert und vertreibt Komponenten, Systeme, Anlagen und Software für die Elektronikfertigung.

    • Microelectronics packaging
    • Electronics production equipment
    • Packaging & assembly equipment (microelectronics)
    • Handling technology & robotics
    • Joining technology
  10. Connexion Technologies

    Contract manufacturer (EMS) · United Kingdom

    electronica 2026
    10 Nov
    A2.479

    A group of specialist electronics manufacturers you can depend on.

    • Microelectronics packaging
    • Rigid PCBs
    • HDI PCBs
    • Rigid-flex PCBs
    • SMT assembly
  11. Strip's d.o.o.

    Contract manufacturer (EMS) · Slovenia

    electronica 2026
    10 Nov
    A1.536

    Providing custom-built electronics & mechatronics solutions for almost 30 years.

    • Microelectronics packaging
    • PCB connectors
    • Hardware / electronics design
    • Box build & system integration
    • Consumer electronics
  12. AUREL S.p.A.

    Type not confirmed · Italy

    electronica 2026
    10 Nov
    B4.269

    Design & manufacture of low power radio solutions. Outsourcing company for IMS board, Power Resistors, Thick Film Technology.

    • Microelectronics packaging
    • Metal-core & thermal PCBs
    • Ceramic substrates & hybrid circuits
    • Wireless modules
    • Telecom, 5G/6G & wireless
  13. Jiangsu SIMAND Electric Co., Ltd.

    Contract manufacturer (EMS) · China

    electronica 2026
    10 Nov
    A6.469/6

    Global provider of integrated solutions for smart controllers

    • Microelectronics packaging
    • Box build & system integration
    • Rigid PCBs
    • Printed & flexible electronics
    • Automotive
  14. Custom Interconnect

    Contract manufacturer (EMS) · United Kingdom

    electronica 2026
    10 Nov
    A2.479

    PCBA and semiconductor packaging (OSAT), wire bonding to box build.

    • Microelectronics packaging
    • MEMS & motion sensors
    • SMT assembly
    • THT assembly
    • Functional & in-circuit testing
  15. Hahn-Schickard gGmbH

    Type not confirmed · Germany

    EFX 2026
    In 5 days
    9B30

    Hahn-Schickard ist Forschungs- und Entwicklungspartner. Von der ersten Idee bis zur Fertigung entwickeln wir für Sie intelligente Produkte mit Mikrosystemtechnik.

    • Microelectronics packaging
    • Ceramic substrates & hybrid circuits
    • Production equipment & automation
    • Materials & consumables
    • Ceramics
  16. Finetech GmbH & Co. KG

    Type not confirmed · Germany

    EFX 2026
    In 5 days
    9A24

    Die bonders and process development. Packaging expertise, concept to production.

    • Microelectronics packaging
    • Packaging & assembly equipment (microelectronics)
    • Production equipment & automation
    • AI & machine learning
    • Telecom, 5G/6G & wireless
  17. BTU INTERNATIONAL Inc.

    Type not confirmed · United States

    EFX 2026
    In 5 days
    9D39

    BTU makes custom furnaces and reflow ovens.

    • Microelectronics packaging
    • Electronics production equipment
    • Production equipment & automation
  18. EFX 2026
    In 5 days
    9D62

    Chiplet Assembly, Hybrid Bonding, Si-Interposer Technologien, Fan-Out Wafer Level Packaging, Kryo-Packaging, die Integration von Speichern mit hoher Bandbreite (HBMs), HF-Charakterisierung und das Packaging für 5G / 6G-Anwendungen sind nur einige Technologien und Beispiele…

    • Microelectronics packaging
    • Production equipment & automation
  19. Photonics Systems GmbH

    Type not confirmed · Germany

    EFX 2026
    In 5 days
    9B70
    • Microelectronics packaging
    • Handling technology & robotics
    • Manufacturing & factory software
    • HDI PCBs
    • Flexible PCBs
  20. Fraunhofer-Institut für Angewandte Festkörperphysik IAF

    Contract manufacturer (EMS) · Germany

    EFX 2026
    In 5 days
    9B36B
    • Microelectronics packaging
    • Manufacturing & factory software
    • Production equipment & automation
    • Design & development
    • AI & machine learning
  21. Hesse GmbH Stammsitz

    Type not confirmed · Germany

    EFX 2026
    In 5 days
    9C48
    • Microelectronics packaging
    • Packaging & assembly equipment (microelectronics)
    • Joining technology
    • Production equipment & automation
    • Joining & welding
  22. HAW Kiel Hochschule für Angewandte Wissenschaften Kiel

    Contract manufacturer (EMS) · Germany

    EFX 2026
    In 5 days
    9B36D
    • Microelectronics packaging
    • Production equipment & automation
    • Design & development
  23. Forschungsfabrik Mikroelektronik Deutschland

    Association or cluster · Germany

    EFX 2026
    In 5 days
    9D60
    • Microelectronics packaging
    • Production equipment & automation
  24. imec Germany GmbH

    Type not confirmed · Germany

    EFX 2026
    In 5 days
    9B36A
    • Microelectronics packaging
    • Production equipment & automation
  25. Pac Tech - Packaging Technologies GmbH

    Type not confirmed · Germany

    EFX 2026
    In 5 days
    9C50
    • Microelectronics packaging
    • Production equipment & automation

Listings come from trade-fair directories and company websites; each profile shows the source of every fact.